Wafer-level calibration of large-scale integrated optical phased arrays.

We present the wafer-level characterization of a 256-channel optical phased array operating at 1550 nm, allowing the sequential testing of different OPA circuits without any packaging steps. Using this, we establish that due to random fabrication variations, nominally identical circuits must be individually calibrated. With this constraint in mind, we present methods that significantly reduce the time needed to calibrate each OPA circuit. In particular, we show that for an OPA of this scale, a genetic optimization algorithm is already >3x faster than a simple hill climbing algorithm. Furthermore, we describe how the phase modulators within the OPA may be individually characterized 'in-situ' and how this information can be used to configure the OPA to emit at any arbitrary angle following a single, initial calibration step.

Metamaterial-Engineered Silicon Beam Splitter Fabricated with Deep UV Immersion Lithography.

Subwavelength grating (SWG) metamaterials have garnered a great interest for their singular capability to shape the material properties and the propagation of light, allowing the realization of devices with unprecedented performance. However, practical SWG implementations are limited by fabrication constraints, such as minimum feature size, that restrict the available design space or compromise compatibility with high-volume fabrication technologies. Indeed, most successful SWG realizations so far relied on electron-beam lithographic techniques, compromising the scalability of the approach. Here, we report the experimental demonstration of an SWG metamaterial engineered beam splitter fabricated with deep-ultraviolet immersion lithography in a 300-mm silicon-on-insulator technology. The metamaterial beam splitter exhibits high performance over a measured bandwidth exceeding 186 nm centered at 1550 nm. These results open a new route for the development of scalable silicon photonic circuits exploiting flexible metamaterial engineering.

Silicon photonic on-chip spatial heterodyne Fourier transform spectrometer exploiting the Jacquinot's advantage.

Silicon photonics on-chip spectrometers are finding important applications in medical diagnostics, pollution monitoring, and astrophysics. Spatial heterodyne Fourier transform spectrometers (SHFTSs) provide a particularly interesting architecture with a powerful passive error correction capability and high spectral resolution. Despite having an intrinsically large optical throughput (étendue, also referred to as Jacquinot's advantage), state-of-the-art silicon SHFTSs have not exploited this advantage yet. Here, we propose and experimentally demonstrate for the first time, to the best of our knowledge, an SHFTS implementing a wide-area light collection system simultaneously feeding an array of 16 interferometers, with an input aperture as large as 90µm×60µm formed by a two-way-fed grating coupler. We experimentally demonstrate 85 pm spectral resolution, 600 pm bandwidth, and 13 dB étendue increase, compared with a device with a conventional grating coupler input. The SHFTS was fabricated using 193 nm deep-UV optical lithography and integrates a large-size input aperture with an interferometer array and monolithic Ge photodetectors, in a 4.5mm2 footprint.

Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station.

Optical phased arrays (OPAs) can produce low-divergence laser beams and can be used to control the emission angle electronically without the need for moving mechanical parts. This technology is particularly useful for beam steering applications. Here, we focus on OPAs integrated into SiN photonic circuits for a wavelength in the near infrared. A characterization method of such circuits is presented, which allows the output beam of integrated OPAs to be shaped and steered. Furthermore, using a wafer-scale characterization setup, several devices can easily be tested across multiple dies on a wafer. In this way, fabrication variations can be studied, and high-performance devices identified. Typical images of OPA beams are shown, including beams emitted from OPAs with and without a uniform waveguide length, and with varying numbers of channels. In addition, the evolution of output beams during the phase optimization process and beam steering in two dimensions is presented. Finally, a study of the variation in the beam divergence of identical devices is performed with respect to their position on the wafer.

Sub-decibel silicon grating couplers based on L-shaped waveguides and engineered subwavelength metamaterials.

The availability of low-loss optical interfaces to couple light between standard optical fibers and high-index-contrast silicon waveguides is essential for the development of chip-integrated nanophotonics. Input and output couplers based on diffraction gratings are attractive coupling solutions. Advanced grating coupler designs, with Bragg or metal mirror underneath, low- and high-index overlays, and multi-level or multi-layer layouts, have proven less useful due to customized or complex fabrication, however. In this work, we propose a rather simpler in design of efficient off-chip fiber couplers that provide a simulated efficiency up to 95% (-0.25 dB) at a wavelength of 1.55 µm. These grating couplers are formed with an L-shaped waveguide profile and synthesized subwavelength grating metamaterials. This concept jointly provides sufficient degrees of freedom to simultaneously control the grating directionality and out-radiated field profile of the grating mode. The proposed chip-to-fiber couplers promote robust sub-decibel coupling of light, yet contain device dimensions (> 120 nm) compatible with standard lithographic technologies presently available in silicon nanophotonic foundries. Fabrication imperfections are also investigated. Dimensional offsets of ± 15 nm in shallow-etch depth and ± 10 nm in linewidth's and mask misalignments are tolerated for a 1-dB loss penalty. The proposed concept is meant to be universal, which is an essential prerequisite for developing reliable and low-cost optical couplers. We foresee that the work on L-shaped grating couplers with sub-decibel coupling efficiencies could also be a valuable direction for silicon chip interfacing in integrated nanophotonics.

SiN integrated optical phased arrays for two-dimensional beam steering at a single near-infrared wavelength.

In this work, we present two-dimensional beam steering in the near-infrared using a SiN integrated circuit, containing optical phased arrays. Beam steering was achieved over a range of 17.6° × 3°, at a fixed wavelength of 905 nm. The first dimension was steered via phase differences between the optical phased array channels. The second dimension was accessed by actively switching between various optical phased array sub-devices containing output diffraction gratings with different periods. The characterisation was performed on a wafer-level test station.

30 GHz heterogeneously integrated capacitive InP-on-Si Mach-Zehnder modulators.

We demonstrate high-bandwidth O-band Mach-Zehnder modulators with indium phosphide-on-silicon (InP-on-Si) capacitive phase shifters that are compatible with heterogeneous laser fabrication processes. An electro-optic conversion efficiency of 1.3 V⋅cm and a 3 dB bandwidth of up to 30 GHz was observed for a phase modulator length of 250 µm at a 0 V bias. Open eye patterns were observed at up to 25 Gb/s.

Integrated waveguide PIN photodiodes exploiting lateral Si/Ge/Si heterojunction.

Germanium photodetectors are considered to be mature components in the silicon photonics device library. They are critical for applications in sensing, communications, or optical interconnects. In this work, we report on design, fabrication, and experimental demonstration of an integrated waveguide PIN photodiode architecture that calls upon lateral double Silicon/Germanium/Silicon (Si/Ge/Si) heterojunctions. This photodiode configuration takes advantage of the compatibility with contact process steps of silicon modulators, yielding reduced fabrication complexity for transmitters and offering high-performance optical characteristics, viable for high-speed and efficient operation near 1.55 µm wavelengths. More specifically, we experimentally obtained at a reverse voltage of 1V a dark current lower than 10 nA, a responsivity higher than 1.1 A/W, and a 3 dB opto-electrical cut-off frequency over 50 GHz. The combined benefits of decreased process complexity and high-performance device operation pave the way towards attractive integration strategies to deploy cost-effective photonic transceivers on silicon-on-insulator substrates.

Robust silicon-on-insulator adiabatic splitter optimized by metamodeling.

A robust integrated power splitter based on a silicon-on-insulator adiabatic coupler configuration is demonstrated. The power separation is achieved by a slow and simultaneous change of phase and coupling constants. The geometrical parameters of the device are determined thanks to a metamodel-based iterative optimization strategy. Solving the multiple parameter problem together with a realistic bandwidth constraint provides a clear improvement of the power splitting stability. The robustness is confirmed experimentally on a single device and at the wafer scale.

Crosstalk analysis of ring resonator switches for all-optical routing.

Optical switches based on ring resonator cavities were fabricated by a silicon photonics foundry process and analyzed for optical crosstalk at various data rates and channel spacings. These devices were compared to commercial bandpass filters and at 20Gb/s, 0.5dB power penalty is observed due to spectral filtering for bit error ratio threshold of 1 × 10-9. Concurrent modulation at 20Gb/s with a channel spacing as narrow as 40GHz shows error-free transmission with 1dB power penalty as compared to wider channel spacing for the ring-based switch.